Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Cut panels without scoreline and with overhanging components. The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs. Singulate panels up to 12" wide. Microprocessor controlled STI safety interlock Long Lasting Di
Low Cost Punch For Singulation Small Tab Routed Panels N200 singulates one tab at a time with upper and lower pinch blades. Singulate curve routed and odd shaped boards. Top and bottom knife set cuts tabs cleanly. Minimal stress on PCB. Toolin
>) or anisotropic conductivity
Designers and manufacturers of digital panel meters and large digital displays for process monitoring and control. The unique INTUITIVE range offers simple, menu-free setup to help users get up and running with minimum stress and time.
Designers and manufacturers of digital panel meters and large digital displays for process monitoring and control. The unique INTUITIVE range offers simple, menu-free setup to help users get up and running with minimum stress and time.
Fancort offers the widest selection of depaneling machines for pre-scored and routed boards from any one company. Our machines are all benchtop, varying in throughput, cost, and stress level. Why select Fancort as your depaneling vendor? More cho
1) Non contact Coplanarity Measuring Module with Reflow Oven 2) Coplanarity measurement for lead free & Hogh Temperature environment. 3) Due to rapid growth of "Lead free solder" usage, surface mounting parts are requested to be heated higher and be
New Equipment | Solder Materials
A rich and line-up of solders possessed of various characteristics and properties. NSH63V forms a strong join and displays excellent resistance to heat cycle stress, thus prolonging the working life of various electrical devices. This solder has
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
