The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli
STABLCOR� is a Thermally Managed PCB / Substrate material technology with many benefits: High Thermal Conductivity with a product family that ranges from 100 W/m K up to 1000 W/m K Can more closely match the CTE mismatch that is common today bet
Best in class thermal performance combined with best in class reliability! Aluminum Nitride (AlN) has a high thermal conductivity (170 W/mK), combined with a low expansion rate and can withstand high operating temperatures while being able to re
New Equipment | Assembly Services
The MCPCB commonly consists of a metal core layer (typically aluminum or copper), a continuous dielectric layer and a copper circuit layer. Protecting electronic components by removing heat, metal base boards feature a thermally conductive dielectri
Thermally Managed � Heat Dissipating PCB�s (Printed Circuit Boards) By STABLCOR Corporation STABLCOR TM Printed Circuit Board Material Product Information STABLCOR Corporation has developed a new printed circuit board technology that has the followin
Managing the Ultimate Reflow Oven Output. The KIC RPI helps manage reflow ovens to consistently maximize the desired results. In addition, the RPI provides process deficiency information in order to help users correct their defect issues quickly. T
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
New Equipment | Curing Equipment
Anda iCure series of curing ovens are compact, inline Infrared (IR) curing systems. These IR curing ovens are suitable for high volume, rapid curing of heat curable coatings, adhesives, and inks., etc. Models: iCure-2 (2 zones) iCure-3 (3 zones)
Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian
.gif)
winsouce.jpg)