Our products consist of the following: * Ovens * Conveyor ovens * Temp/Humd/thermal shock chambers * Thermal curing * HALT/HASS chambers * Meter Mix Dispensing machines * Sinterite furnaces * Infrared oven systems * PCB thickness measurement
We have various euipment avilable: Re-flow ovens Tape & Reel Inpsection Test Marking Probers Ovens - Burn-in, Temp Cycle, Thermal Shock, Humidity and temp.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
* Provides dimensionally stable support platform for PCB * Protects SMT components from heat or thermal shock * Reduce/eliminate manual labor for hand masking operation, glue dotting, and hand soldering * Reduce solder defects (ex. Bridges and skips)
Streamtek Electronics provide HiRel SMD Packages. Standard products include SMD-2, SMD-1, SMD-0.5, SMD-0.2, TO263 package, SMD-FP Package and customized packages with similar configuration. These packages are complied with MIL-PRF-19500, MIL-STD-750,
Specifically engineered for water resistance on printed circuit board protection and LED component protection in membrane switches. Surface Resistivity: 3.8 x 1014 ω/■ Insulation resistance of cured films of UV-3010 at 100°C and 95% relative h
Product Name MFA Power（W） 0.5W,1W,2W Output Voltage(KV) ,3,4,5,6,7.5,8,9,10, DIMENSIONS： 1KV-10KV：2.50L(63.50L)X1.25W(31.75W)X0.68H(17.34H) APPLICATIONS High voltage testing PMT,MCP,radiation counter Electron Beam/Ion Beam Mass spectrome
Commercial-off-the-shelf (COTS) PC/104 and PC/104-Plus computer cards and components, including x86 and PowerPC CPUs; DC/DC converter power supplies and interfaces; fan cards and heatsinks; digital I/O and mass storage boards; fieldbus interfaces (C
Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
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