CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
PCB assembly: SMT, Thru-Hole, & Mixed Technology. PCB design offered.
SMT and thru-hole switches. Low profile and specialized switches which can save PCB real estate.
BGA, SMD & thru-hole assembly, desoldering, rework & repair systems. Fume extraction and filtration systems. Training videos and services.
So. California ISO 9001 certified provider of electronic design and manufacturing services, focusing on Low-Mid volume and High-mix SMT and Thru-Hole assemblies.
Schematic Entry PCB Layout Power Circuit Design EMI and UL Knowledge Surface Mount, Thru-Hole, Mixed Technology, Flex Circuitry Library PCB and Scematic capture Fabrication
Schematic Entry PCB Layout Power Circuit Design EMI and UL Knowledge Surface Mount, Thru-Hole, Mixed Technology, Flex Circuitry Library PCB and Scematic capture Fabrication
Self-contained, three channel capability offers high capacity, low temperature SMT/Thru-Hole soldering and desoldering. Digital readout displays the current channel's temperature information, error codes and programming status.
Double Pump for a quick and powerful suction and easy clean up. Designed For SMT and Thru-hole Desoldering of Eutectic or Lead Free Solders.
New Equipment | Rework & Repair Equipment
Thru-hole components SMD components BGA, µBGA, CSP components http://www.selen.hr/pokaz_kategorie.php?cid=44
