ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide. Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref
New Equipment | Test Equipment
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us
New Equipment | Selective Soldering
The Vitronics Soltec mySelective 6746 is a selective soldering automation workcell that has been optimized for maximum throughput and flexibility while minimizing its footprint in the factory. Inline processes and intuitive programming features enhan
New Equipment | Test Equipment
The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution o
SCALABLE, COST-EFFECTIVE SOLUTION FOR HIGH-MIX & NPI Combines the capability, flexibility, and reliability you expect from Panasonic’s award-winning NPM and PanaCIM® Manufacturing Execution System (MES) into a cost-effective, high-mix solution. T
New Equipment | Selective Soldering
Setting the standard! All-in-one inline selective soldering machine for increased productivity, reliability, and ultimate flexibility. High quality, flexibility and reliabilty offered in a complete all-in-one package is what you get with the inline
Stinger is a low volume dispense module attached to the camera carriage of a standard DEK printer (as an optional extra). It is not designed to replace a regular dispenser but to provide dual functionality to the print platform for customers who requ
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
