New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Solder Materials
Paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering. BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Four types
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
New Equipment | Solder Materials
To meet the increased demands imposed by the higher operating temperatures involved in successful lead free soldering, DKL Metals have released new flux products designed specifically for this environment. A selection of the most popular, incorporati
Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
New Equipment | Solder Materials
AIM’s W20 water soluble solder paste is a zero halide/halogen flux formula. W20 has been engineered for enhanced wetting performance on all solderable electronic surfaces. W20 exhibits excellent print characteristics and 8+ hours of stencil life. W20
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