Electronics Forum | Mon Sep 06 20:18:37 EDT 2004 | charly
hi, we are running high mixed low volume here, and i encounter many pcb delam after reflow issue. here some doubt need ur advise: 1. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? if i allow bare
Electronics Forum | Wed May 04 10:42:55 EDT 2005 | nice90
Handling a PCB 1. Check your ESD slippers and ESD Strap first before entering the SMT production line 2. A PCB manufactred over 90 days must be stored first on the baking Oven before Production 3. Temperature on the Baking oven must be 125plus and m
Electronics Forum | Mon Sep 12 10:53:22 EDT 2005 | cmiller
The Advantis was more accurate than the turret, so he claimed. The Single beam (dual lead screw drive-this is not a GSM 1) flex machine is $125K the Lightning is $150K. They changed the pricing in 2004. I was quoted a Topaz XII at $187K. I know Phili
Electronics Forum | Fri Sep 16 11:58:46 EDT 2005 | vinod
Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.
Electronics Forum | Fri Sep 16 13:19:59 EDT 2005 | vinod
Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.
Electronics Forum | Thu Oct 27 11:45:06 EDT 2005 | Jeffm
I have a multi layer (8) PWB with blind vias going from 1 to 7 that is experiencing occasional blistering (delam). It is only on perhaps 15% of the boards run. We vacuum baked (85C, not sure what pressure) a sample lot and still had a few exhibit the
Electronics Forum | Sat Oct 29 09:10:17 EDT 2005 | davef
You're correct that Room Temperature Vulcanizing (RTV) adhesive is pretty much a cosmetic when it comes to securing components. Beyond that it contains silicone, which produces unsolderable connections in electronics. Further, many RTV seep acidic
Electronics Forum | Wed Feb 15 19:27:24 EST 2006 | CW
Reviewing the J-STD-033A procedure and try to better understand Table 4-1 ... There are 3 columns for Baking Temperature & recommended Duration ... 1st one is for 125C, then for 90C, then followed by 40C ... it also specify the environmental condi
Electronics Forum | Wed Apr 26 05:03:30 EDT 2006 | Darren
Hi We have a new product that has a 22uF 0805 X5R 6.3V Chip Cap. It is placed on standard 0805 pads but is 1.25 mm high and although we are not getting the best fillet it appears sufficient. The trouble is we are getting a small number of returns
Electronics Forum | Tue Jun 20 14:54:02 EDT 2006 | grantp
Hi, That's a really interesting article, however one thing I am a little confused on. They seem to say a Pb-Pb solder joint is almost as bad as a Pb-lead free joint in their results. Are they saying the testing which looks like it cycles up to 125 D
