Electronics Forum | Mon Aug 23 12:33:40 EDT 2004 | rlackey
Hi Ozzy, Second one sounds like a 220nf /0.22uf 16v tant. No idea on the first. Rob.
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Mon Aug 13 12:38:38 EDT 2012 | grahamcooper22
Maybe the area ratio between the sides of the stencil apertures and the aperture opening is too low for the spec of the paste ? So it will tend to stick in the apertures. ...only solution is thinner stencil or a paste that can release easily when are
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Tue May 29 17:24:28 EDT 2001 | hussman
OK, I have a new product being tossed over "the wall" that has a flex circuit layered into a standard FR board and protrudes out of it. The flex circuit is 0.022" thick and is the 3rd layer of 6 layers. The total board thickness of the FR board is
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Thu Mar 25 23:23:00 EDT 2021 | llawrence
The QFP pitch is 0.5mm. Pad size is 1.475 x 0.3mm, and the new aperture size is 1.32 x 0.22mm. I'm not sure about whether or not it is lasered, but on the newly ordered stencil I selected the polishing option. Looks like the pad width is already 2/3
Electronics Forum | Fri Apr 06 12:25:55 EDT 2007 | mika
Thanks DaveF, Ohh I still whish there was a way to share some pictures... * Pads on pcb are very very strange: It varies from a non uniform pattern but after we measure these I would say ~0.22 - 0.24mm dia. Haha, We have never discovered such a stra
Electronics Forum | Wed Apr 11 00:17:03 EDT 2001 | Dreamsniper
Hi, We got a 0.5mm pitch QFP144 from Altera with the below lead width specs. min. lead width = 0.17mm nominal = 0.22mm maximum = 0.27 What's the best pad or land width for the above? This is what our designer used. Land Width = Component Lead Wi
