Electronics Forum | Thu Jun 09 07:02:02 EDT 2005 | ajaydoshi
1. We do have PCB with 0402 component, Micro BGA ( 0.5mm pitch , 0.25 mm pad size ). PCB thickness is 0.8mm. What stencil thickness we should use. PCB size 40 mm X 60 mm 2. We have EKRA E4 , What will be optimum setting for above. Pressure, Scquge s
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
Electronics Forum | Wed Dec 24 11:49:46 EST 2008 | bandjwet
Put on your thinking caps for this one......We are trying to remove a BGA (10 x 10mm, plastic, 0.8mm pitch) which is approx 3 mm next to another BGA (5 x 5mm, plastic, 0.8mm pitch). The challenge is this second device is underfilled with a softening
Electronics Forum | Wed Jul 19 01:20:17 EDT 2000 | Craig
Does anyone have any experience wave soldering TQFPs. Our R&D is wanting us to do this but we (production) are hesitant. I've found some recommended pad designs and solder theiving designs in a Philips app note "SMD Mounting Methods". The theory look
Electronics Forum | Mon May 22 09:13:12 EDT 2000 | Wolfgang Busko
Hi Sal, I don�t have the solution to your problems but my first thought is warpage. I�ve seen similar things caused by exessive warpage of PCBs 1,6mm thick sometimes and with 0,8mm and T-SOP 50% showed this symptom. Prebaking and a fixture to counte
Electronics Forum | Tue Apr 09 16:19:37 EDT 2002 | Peter L.
Has anyone built using the ALIVH PCB (0402, 0.8mm pitch uBGA) on the SMT line? I would like to know any process issues (paste printing, p&p, reflow) related to processing this pcb. Specifically, what type of solder paste was used (no clean) and wha
Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg
Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su
Electronics Forum | Mon Jan 13 15:20:04 EST 2003 | JohnW
Russ, unfortunately at the moment the preferred option of hi melt isn't available due to copyright issues. The current ball is made of 46/46/8 tin / lead / bismuth. ther ball's are 0.8mm in dia. The alloy actually has a plastic region around 170 and
Electronics Forum | Fri Jun 13 10:37:38 EDT 2003 | joeherz
I may have the oppurtunity to purchase this machine. My experience with in-line machines is limited to Trek (Triton IV) and Electrovert (aquastorm) having success and failure with both. The equipment would be used strictly for an OA chemistry and w
