Electronics Forum | Fri Sep 11 14:39:02 EDT 1998 | Earl Moon
| Thanks to all Earl, Mathew and David for the SMT info. I have one more question. Does anybody have a chart listing the standard, industrial spacings? Perhaps listing in each unit, say XX mils = XX Pitch. Or XX mils = XXmm or something of that n
Electronics Forum | Mon Jul 20 12:58:51 EDT 1998 | Dew Lolly
QFP's are best left the professionals. There are MANY subtle issues with fine pitch lead forming such as critical tool design issues ability to check critical dimensions etc. Unless you want to replow this grown in hopes of getting a promotion or c
Electronics Forum | Tue Jan 02 16:49:14 EST 2007 | dyoungquist
I am looking for data on the yield of printed circuit board assemblies so that I can judge if our SMT line is performing up to typical industry standards. Following I will describe the details of the assembly and what our yield has been. Each board
Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james
We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which
Electronics Forum | Thu May 10 13:58:26 EDT 2001 | tomgervascio
It sounds like 3D imaging is much better at fault detection for partially visible leads like SOJ packages. Can any of the 2D systems actually do a solderjoint inspection on the outer rows of BGAs or is the angle too acute to accurately look at these.
Electronics Forum | Mon Jul 20 15:11:34 EDT 1998 | Scott McKee
| QFP's are best left the professionals. There are MANY subtle issues with fine pitch lead forming such as critical tool design issues ability to check critical dimensions etc. Unless you want to replow this grown in hopes of getting a promotion or
Electronics Forum | Thu May 11 12:44:04 EDT 2006 | slthomas
One of our customers' products has a couple of adjacent 0603 packages (one resistor, one cap) that are .010" apart. They are side by side, not end to end. The adjacent pads between the two parts are electrically connected so bridging isn't an issu
Electronics Forum | Mon May 07 09:46:15 EDT 2001 | orbotech
3D imaging refers to the acquisition of images from multiple perspectives using, preferably, multiple sources of illumination, while 2D imaging refers to the acquisition of an image from one perspective. An AOI system with 3D imaging is able to acq
Electronics Forum | Wed Jul 09 16:05:12 EDT 2008 | bkreiman
We are using a right-angle SMT power connector on a board. The connector has 4 leads and two board alignment pins. The layout for the board is such that 1 of the leads is not used and the pad for the lead is not connected to anything, not even grou
Electronics Forum | Mon Mar 01 10:36:55 EST 2010 | patrickbruneel
Loco, Since Dave didn't respond i will. We shouldn't forget that even when using tin/lead solder the boards and components are still lead free. Parts that are not completely wetted by the tin/lead solder still have the potential for tin whiskering a
