Electronics Forum | Mon Nov 15 17:42:02 EST 2021 | kumarb
Did you get this straightened out? If not, reach out to IRV or RUDI - they have been great for the tech support of our Ekra machine. ASYS Group Americas Inc. 140 Satellite Blvd NE, Suite D, Suwanee, GA 30024, USA Tel +1 770 246 9706 Fax
Electronics Forum | Wed Feb 23 11:23:42 EST 2000 | Jeff Sanchez
Hi everyone, I just installed a batch oven in my shop. It;s an older Advanced Techniques PRO-90. I need to know what a good and simple profile is for it. I want to run some simple double sided boards with 63/37 no clean paste. The machine of
Electronics Forum | Wed Feb 23 14:44:28 EST 2000 | Travis Slaughter
Your solder paste manufacturer should determine the time. As far as temperatures those will very with each board. Creating a profile comes down to trial and error, there are some nice tools that help, the MOLE profiler is one, but there are just wa
Electronics Forum | Tue Sep 19 14:40:13 EDT 2000 | Erick Russell
It is always a good idea to heat the entire board to 100C to 140C prior to reflowing the site to be reworked to reduce warp and localized stress. (Thermal uniformity of the preheater is key here). For a BGA, the laser is programmed to heat only the
Electronics Forum | Tue Jul 17 18:19:09 EDT 2001 | dave
CONNECTOR, 4 X 40, MALE, SM, 0.472 STANDOFF301-00030TOLC�Mount(1,27mm),.050",(0,64mm) .025",micro pitch Looking for someone who has had experience placing this Samtec style of connector .We are having issue with open solder and insufficent. We are no
Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
Electronics Forum | Fri May 21 10:16:31 EDT 1999 | Parvez
Dave, i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered to b
Electronics Forum | Wed Jun 03 08:46:32 EDT 1998 | Ryan Jennens
Thanks everybody for the help! We are still working on the bottom side, but the top side solder balling seems to have gone away for now. We flattened out the middle soak zone of the profile, so that rather than an even ramp up, the board heats quick
Electronics Forum | Fri Apr 24 15:21:08 EDT 1998 | Earl Moon
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
Electronics Forum | Wed Jan 02 12:32:24 EST 2002 | cebukid
What is the rule-of-thumb on wave profiling Ceramics? I've used 2 methods: 1.) putting the T/C on the lead, and get a pretty good delta (within 50-80 deg. before hitting chip wave), well within manufacturer's spec. 2.) Right on the part body.
