Electronics Forum | Wed Aug 09 04:09:04 EDT 2000 | Jarno Py�ri�
Hello. I think, good stencil apertures is 80% from pad. And stencil thickness is 0.15mm - 0.20mm. I use 0.15mm thick stencil almost every pcb. Sorry my very bad english but i too learning. :)
Electronics Forum | Wed Dec 21 20:41:49 EST 2016 | epcb2016
1.5mm pad is not so ok in practice. You may expand the size to 2.0mm.
Electronics Forum | Fri Oct 11 09:41:22 EDT 2013 | wooly1
Does anybody know of some place that can reball a VFBGA component that is 7mm x 7mm in actual size? I have several that need to be done if they can be. I have only been able to find places that go down to 15mm x 15mm in size. Any info would be awesom
Electronics Forum | Tue May 19 12:09:08 EDT 2020 | greezmky
Thank you all that contributed to the troubleshooting! I measured the height of 10+ parts with calipers and found the average to be around 2.15mm. In the program height was set to 2.42mm. I reduced the height to 2.15mm. I have since ran 561 boards
Electronics Forum | Fri Feb 11 02:42:17 EST 2005 | marakas
Thank you very much for your answer. We had: 1- 224 pins, size 19*19 mm, pitch 0.8 mm 4- 48 pins, size 11*7 mm, pitch 0.75 mm 1- 160 pins, size 15*15 mm, pitch 1 mm 1- 196 pins, size 15*15 mm, pitch 1 mm How many defects I should expect with th
Electronics Forum | Mon Aug 21 10:47:48 EDT 2006 | FredC
Hello Mika, I just checked a windmill and a test nozzle we have on the bench. The useful travel of the nozzle before the risk of the crosspin getting stuck in the loading gate is 1.5mm, if it gets stuck it is the nozzle is 1.7 up. If the cross pin is
Electronics Forum | Tue Jul 12 08:54:34 EDT 2016 | leeg
well there you go. I found that trying > different values in the "Placing Stroke" had a > big effect. I changed it to 2mm and it placed > them well, but I could see the board also flexing > a little, went to 1mm and the problem came back, > so
Electronics Forum | Mon Jun 13 14:34:16 EDT 2005 | peter ng
The stencil thickness should be 5.5 mils.The squeeze speed around 20mm/s,print gap 0.15mm,print separation 0.3mm/s.
Electronics Forum | Sat Oct 28 10:24:56 EDT 2000 | Ben
Try to insert thin copper plate (approx. 1.5mm thk) at the end of the flow direction. Place it approx. 2mm away from the lead. The copper will pull away the solder & thus minimise bridging problem.
Electronics Forum | Fri Dec 03 08:06:23 EST 1999 | Mark Anderson
Firstly, Verify your Z-height per the procedure in the Maintenance manual. In general, release the placement stopper and rotate cam onto flat surface of board with z-axis at zero. There should be 0.15 mm compression of the spring
.gif)
winsouce.jpg)