Electronics Forum | Thu Jan 24 04:54:43 EST 2002 | wbu
Well Greg, I don�t know YOUR 0805 Pads but if you look at the recommended pattern for 0805 in IPC-SM-782 you might notice that the Z-dimension is somewhat about the size of your 1206 part length. With that and assuming that you ask if the results wi
Electronics Forum | Fri Feb 01 10:19:22 EST 2002 | cyber_wolf
Whoa! I beg to differ my friend. The cure profile is VERY critical in Adhesive curing, especially if your are screen printing. When you screen print adhesive you are leaving it exposed to the atmosphere for a period of time. SMT adhesive by nature i
Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto
Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures
Electronics Forum | Thu Apr 25 09:34:24 EDT 2002 | fmonette
Michael, By the way, the default bake duration should be 48 hours at 125C instead of 24 hours. The shorter duration was based on a standard that is now obsolete. The current revision of J-STD-033 includes a variable duration bake table, based on co
Electronics Forum | Tue Feb 19 15:59:55 EST 2002 | pjc
Surface tension is a likely cause. Surface tension is a negative wetting force. You may have a solderability problem. Be sure your flux is properly activated according to the flux mfg. top side board temp. specification. When surfaces to be soldered,
Electronics Forum | Wed Feb 27 14:07:25 EST 2002 | Stefan
In order to kiss off the components with an air blow, there are two times to consider: 1. reaction time of the solenoid ( to shut off the vacuum and turn on the air ), 5-10 ms 2. time required to fill up an air hose, which leads to the nozzle. Assumi
Electronics Forum | Wed Feb 27 22:24:28 EST 2002 | davef
I own and have read this book. While it is better than the average soldering book, it is not the first book that I reach for in trying to sort through a problem. It introduces a broad range of soldering methods with a reasonable amount of detail, b
Electronics Forum | Thu Feb 28 07:57:52 EST 2002 | caldon
Marcos- BGA's and soldering manually is difficult. Typically soldering BGAs requires reflow just as a reflow oven does, so I recommend a rework station. Go to http://www.empf.org/html/empfset.htm and download Jan 2002, Dec 2001, Sep 2001, Aug 2001,
Electronics Forum | Tue Mar 05 20:00:47 EST 2002 | rwilliams
I have recently been handed all responsibility of our Reflow Ovens. Upon my inspection, I discovered that any possible device on the ovens that you would think would require calibration, has a sticker indicating no calibration required. The practice
Electronics Forum | Thu Mar 07 12:33:39 EST 2002 | peterson
We are currently examining the issue of AOI machines (both in-line and off-line) It seems that the only positive remarks I find are written by the salespeople representing AOI manufacturers. Can someone please refer me to a more neutral source? My in
