Electronics Forum: 2.4.8 (Page 1 of 1)

Pull Test

Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef

A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl

Re: Passive component shear Testing

Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F

Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for

Re: copper land delamination

Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F

Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l

Solder joint srength

Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef

Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l

Ultra low cost pick & place?

Electronics Forum | Wed Nov 04 17:47:51 EST 2009 | locostpp

Q3/2009 been and gone. We are moving forward with low cost p&p, quite a few things have changed. We are applying for a number of patents for the feeders, placement head design, servo design, calibration system , etc... We now expect the price of t

Re: Qualifying new PWB Vendors

Electronics Forum | Sat Jan 16 02:43:21 EST 1999 | Earl Moon

| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have

Re: PCB fab supplier supplier/evaluation

Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon

| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo

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