Electronics Forum: 2000 (Page 221 of 505)

Bakeing

Electronics Forum | Mon Nov 20 06:51:00 EST 2000 | Daniel Carlsson

Does anyone have information regarding: -Moisture level (wt%) that may cause delamination in PCB�s. -Baking time and temperature if using a Vacuum Drying Cabinett and if using an air oven. (What I�m most interested of is Poly-Imid-Aramid.) -Are ther

Solderability of BGA and PCB

Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver

Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol

Accepting Stencils

Electronics Forum | Thu Nov 16 18:19:10 EST 2000 | Dave F

We want to improve our process for accepting SMT solder paste stencils received from suppliers. Our process: * E-mail CAD aperatures to supplier with "readme" giving specific fabrication instructions to the supplier. * Receive stencil from the suppl

Re: Accepting Stencils

Electronics Forum | Tue Nov 21 15:49:01 EST 2000 | CAL

Dave- this may not be much current help but for future needs: IPC-7525 Stencil Design Guidelines is due out real soon. Check with IPC on its status, last I heard it was in interim Final.What is nice about this Doccument is that it also covers Pin_Thr

Quality Benchmark for SMT Processes

Electronics Forum | Thu Nov 16 16:20:23 EST 2000 | bkringen

We are a manufacturing facility of ruggedized offroad electronic control systems. We are looking for industry standards/benchmarks we can use to compare with other manufacturers with regards to our DPMO rate for our SMT process. We would like to kno

BGA Non-wet (head in pillow)

Electronics Forum | Wed Nov 15 16:14:02 EST 2000 | Scott Welle

We are having non-wet (head in pillow) problems with Altera 484's similar to the problems discussed on 10/27 timeframe. Need contacts to those people having similar problems. Will those who had problems with Motorola 357 (ref Chris and Glenn on 10/

Re: Toombstone

Electronics Forum | Mon Nov 20 05:45:39 EST 2000 | Daniel Carlsson

Hi! Some varibles that I would think increase the risk: -The use of Nitrogen when soldering. -The use of IR may cause thermal vias (if placed only on one "side") to produce uneven heat distribution and thus wick the comp. -Uneven heat distribution.

Spikes with our selective solder ERSA machine

Electronics Forum | Tue Nov 14 16:06:27 EST 2000 | zorox

We have an ERSA machine here where we have solder "spikes" occasionally. We have made sure our flux is dispensing properly, we have adjusted z axis speeds, our preheater is heating properly, adjusted XY speeds, etc. Can anyone think of something we m

Re: Recommended DPAK land pattern is too small...???

Electronics Forum | Tue Nov 14 23:49:37 EST 2000 | DL

Our land patterns are slightly bigger than the part, we've had no problems. There are your own concerns about the part hanging over the pads, this can be ok or not depending on your application and/or how much part is over. I'm sure this is in the J-

ECD Oven/Wave Rider

Electronics Forum | Mon Nov 13 13:16:12 EST 2000 | Sal

Guys Has anyone had good or bad experiences with the ECD Oven/Wave rider piece of kit ? Before I ask my manager to break the bank to pay for this kit what I would like to know is what will it do for me ? but more importantly will it give the custome


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