Electronics Forum | Fri Sep 11 14:45:03 EDT 1998 | Earl Moon
| | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because t
Electronics Forum | Thu Jun 13 09:39:43 EDT 2019 | don_julio
Problem is I don't have a mesh belt (lesson learned). Our conveyor is pins. If I laid some scrap pcb's spanning the conveyor pins on the long dimension of the board, I'm confident it would sag. We get a bit of sag today in our 1.6mm thick boards whi
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Wed Jun 16 15:44:52 EDT 1999 | Jagman
| WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. | CAN BOARDS BE
Electronics Forum | Sat Aug 07 09:32:54 EDT 2010 | scotceltic
We have a Large LGA package (40mm X 40mm) that we are trying to process on a double-sided assembly. problem is the only space we have for it is on 1st side processing side. Therefore we have worries about falling off in the oven during the 2nd side
Electronics Forum | Thu Jun 17 09:50:27 EDT 1999 | Brian Wycoff
| | WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. | | CAN BOARDS
Electronics Forum | Wed May 06 13:44:58 EDT 1998 | Chrys
| Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DI
Electronics Forum | Mon Jun 19 18:17:43 EDT 2006 | PWH
We are now running SMT ROHS assemblies. We are losing some upside down parts in the reflow oven when running the 2nd side. These are parts that do not fall off the leaded version. Anybody else having problems with this? What are you doing to stop
Electronics Forum | Tue May 24 13:18:43 EDT 2011 | leemeyer
We had a Quad 4C that was fitted with a dispensing nozzle. It was perfect for jobs like this. Place the 1st component in the paste, add a dot or 2 of paste to the top of that part and then place the 2nd component on top. I beleive that you may be ta
Electronics Forum | Mon Oct 15 08:15:41 EDT 2012 | scottp
Is the designer's concern that the parts will fall off when hanging upside down during reflow? We've been doing this for decades and our test if we think a part is marginal is to glue a 2nd (and sometimes 3rd) part to the back and send it through re
