Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Wed Apr 18 16:13:43 EDT 2012 | tomzee
Hello All. First time poster. I need to design a PCB which will include a Bumped-die type chip with 6mil (152.4 um) pad pitch. I read somewhere that FR4 type board may not be a good choice for such small footprint. I have not had to deal with board
Electronics Forum | Thu Sep 30 06:47:51 EDT 1999 | park kyung sam
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | we have placed 16 mil components for 3 years. why don't
Electronics Forum | Tue Sep 21 13:12:56 EDT 1999 | Dave F
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | Greg: I was going to link you to the IPC land pattern c
Electronics Forum | Tue Jul 07 12:52:02 EDT 1998 | Upinder Singh
Thanks Earl. Well following is the data regarding the product. 1. The panel consists of 21 boards. 2. The surface I mentioned would have 3 SMds and 1 T/hole connector. 3. PCB thickness is 55 mils and the width of the hole on the PCB for the thru-
Electronics Forum | Wed Sep 22 21:12:16 EDT 1999 | se
| | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | thanks | | | | | | | We use 6 mil lasercu
Electronics Forum | Mon Jul 06 13:17:50 EDT 1998 | Upinder Singh
| | Hi all . | | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | | I would appreciate if somebody could help me in the stated issue: | | I am trying to to place one thru hole 20 pin connector along with the SMT components by p
Electronics Forum | Mon Nov 05 16:54:00 EST 2007 | bbarton
There are several things that can be done to increase throughput on you screen printer, including the panelization of your bords as Steve & Hussman has pointed out. However that's of limited use if you have plenty of stock that is not panelized. That
Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
| 1 |
