Electronics Forum: 4000-29 (Page 1 of 1)

Why delamination happens on PCBs?

Electronics Forum | Wed Jun 22 02:30:33 EDT 2011 | boardhouse

if its a RoHs Assembly they should be using an FR4 material designed with higher TD to handle higher Assembly temps. 370HR,IT158, IT180, 4000-29 just to name a few that would be suitable. Standard FR4 material is not designed to handle the higher as

High TG?

Electronics Forum | Wed Nov 15 09:36:27 EST 2006 | Board House

Hi AJ, The biggest mistake in the industry today is documentation for lead free assembly required product. We are still seeing prints coming in saying Lead Free / High TG FR4. When in reality standard FR4 170 Tg. material is considered High Tg. and L

FR4 boards Delamination Cause?

Electronics Forum | Thu May 08 12:11:30 EDT 2008 | boardhouse

Hi Wayne, I am just curious what material is being called out. Are you just specing FR4 or are you calling out a particular IPC 4101 / Some recommended laminates designed for Lead free assembly are: Isola 370HR Nelco 4000-11 or 4000-29 Iteq IT15

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