Electronics Forum | Fri Dec 18 00:48:35 EST 1998 | Mr Mariscal
I have developing a BGA Process and having problems with 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the stange thing is that it does not happ
Electronics Forum | Sat Oct 17 23:54:15 EDT 1998 | Kallol Chakraborty
the size of panel > is the free real-state) or greater, would help in selective stiffening of the panel itself for multiple placement for multiple assemblies hence achieving cost reduction. Hope it helps. If you need any info. for our company for t
Electronics Forum | Wed Sep 30 11:42:45 EDT 1998 | Ray N. Lopez Mata
I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. I would need the material to be of such a nature that I could form a cover by
Electronics Forum | Fri Apr 12 13:22:49 EDT 2002 | mikecollier
I am currently exploring the option of screenprinting chipbonder for backside devices, mostly passives, 0603 and up. Does anyone have any experience with this? What are the pros/cons? What are the stencil design considerations? What about blades,
Electronics Forum | Wed Jun 26 01:08:09 EDT 2002 | ianchan
Hi Dave F, I'd hold you to that "could" opinion of yours... and I'd be most willing to give the new VP ovens a try if such ovens become commerically acceptable to the pocket and match up to our current process control requirements (that we can achie
Electronics Forum | Mon Aug 12 19:35:42 EDT 2002 | sleech
Been there, ... done that,...got the T-shirt. When with a major IC manufacturer, we tried this. IT DIDN'T WORK! The problem was that most convection ovens leak. We could not achieve a significant N2 atmosphere.Eventually went to vacuum-assisted bak
Electronics Forum | Mon Sep 16 03:10:32 EDT 2002 | stefano_bolleri
Do you mean, rows of pins at the edge of the substrate, making it a SIP/DIP component? This is achieved by attaching leadframes with dedicated technology, and is a typical high-volume application. If you confirm this is what you are looking for, ther
Electronics Forum | Fri Mar 28 09:44:11 EST 2003 | Claude_Couture
Your preheat temp seems excessive, what kind of solder paste do you use. can you try a max preheat temp of 140 degC? The reason for this is to let the solvents in the paste evaporate while keeping the activation of the flux for the very last moment b
Electronics Forum | Fri May 16 08:13:26 EDT 2003 | radney
We are a mixed volume facility and we are doing our utmost to achieve 55% utilization on HSP's (UIC 4797's and 4791's) We are basing this on a world class metric. I am wondering if anyone else out there is measuring utilization, what sort of result
Electronics Forum | Tue Jun 17 01:45:30 EDT 2003 | Dreamsniper
Hi, All these guys have provided you good solid infos already! All I can say is that check your wave solder machine's mechanical set-up too...and the Molten Solder Level in the bath must be maintained at an accurate level/height specially after ded
