Electronics Forum | Mon Oct 11 12:24:07 EDT 1999 | John Thorup
| | Folk's, | | | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | | I was wanting to do a straw poll on you guy's as to the type of resist's yo
Electronics Forum | Mon Oct 11 13:05:51 EDT 1999 | Dave F
| | Folk's, | | | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | | I was wanting to do a straw poll on you guy's as to the type of resist's yo
Electronics Forum | Tue Oct 05 18:37:19 EDT 1999 | Morris
| I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Our
Electronics Forum | Wed Oct 06 08:55:23 EDT 1999 | Brian Conner
| | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Ou
Electronics Forum | Wed Oct 06 11:58:33 EDT 1999 | Wolfgang Busko
| | | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)
Electronics Forum | Thu Oct 07 06:02:38 EDT 1999 | Wolfgang Busko
| | | | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life
Electronics Forum | Tue Oct 05 06:03:37 EDT 1999 | Graham Naisbitt
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Tue Sep 28 10:58:20 EDT 1999 | Wolfgang Busko
| GUYS THANKS FOR THE INFO YOU SENT ME . NOW FOR MY | NEXT QUESTION. HOW DO I MARKET MY COMPANY? WHERE | DO I BEGIN TO LOOK FOR NEW CUSTOMERS WILLING TO TAKE | A CHANCE ON A NEW COMPANY WITH NO PROVEN TRACK RECORD? | WHAT ARE SOME OF THE QUESTIONS I'
