Electronics Forum | Fri Oct 27 07:39:54 EDT 2006 | jdumont
Just wondering if anyone has seen this problem before. We are using a 456 ball FPGA and during installation on our BGA rework machine the corners curl up causing opens there. The part was profiled with our KIC and matches the paste MFG spec. Is this
Electronics Forum | Fri Nov 03 15:51:48 EST 2006 | gcolbert
Hi all I'm gathering Manufacture part numbers that are ROHS for a future build and ran into a problem. The hardware (nuts and bolts for heat sinks, etc. is not ROHS. Does anyone know a harware manufacture that carries ROHS parts. I talked to McMaste
Electronics Forum | Mon Nov 20 21:55:21 EST 2006 | brodalvin
Does SnPbAg solder paste have a reliability risk if subjected 2 times in reflow oven at 230�C? I want to implement my project immediately. If samples will be subjected to our reliability it would take three months before I can implement my project.
Electronics Forum | Mon Dec 04 20:57:09 EST 2006 | callckq
Hello, I did EDX on BGA just to find out copper wt% at the package- ball interface. Is wt% ranging from 20 to 32 considered as normal?? As far as I know lead free BGA and solder paste just have little copper..Where is this excess copper come from
Electronics Forum | Fri Dec 15 09:44:38 EST 2006 | mashmo
Hello I am a circuit board designer and just wanted to ask if anyone is seeing the need to alter footprints for ROHS assembly. I also wanted to make sure that I have this particular issue correct. If your BGA is lead free then used solder paste with
Electronics Forum | Fri Dec 15 11:06:06 EST 2006 | Gman
Hello All, Is Ionic Cleanliness testing using say an Ionograph on No-clean assemblies a valid test? If not, why? I understand factors like PCB cleanliness but is the 1.56ug/in2 IPC criteria valid for no-clean assemblies and can an Ionograph be used
Electronics Forum | Sat Dec 16 09:42:41 EST 2006 | Frank
Hi all, Having been designing (3d modelling and programming) stencils and tooling (solderwave carriers,print support etc) for several years I am now investigating whether it would be possible to do this from home. I live in the UK and am therefo
Electronics Forum | Sat Dec 16 09:47:53 EST 2006 | Frank
Hi all, Having been designing (3d modelling and programming) stencils and tooling (solderwave carriers,print support etc) for several years I am now investigating whether it would be possible to do this from home. I live in the UK and am therefore ab
Electronics Forum | Wed Jan 03 16:52:19 EST 2007 | Pete
What is a foolproof means of eliminating moisture content from Printed Circuits that arrive (bot hpurchased and consigned) in unsealed, non-dessicant packed bags? Als, is there a procedure for basic mass of boards vs. temp/cure times? I need to min
Electronics Forum | Thu Jan 18 14:03:09 EST 2007 | pima
Hello everybody!! I would like to know what kind of tool do you use to analize pick-up error rate at CP and IP fuji machines? Is it special kind of software or you use some customized solutions? Im thinking about writing some kind of database based
