Electronics Forum | Wed Nov 07 13:00:41 EST 2007 | jdumont
Hello all, we are having issues with some specific package type aluminum caps we use while running lead free. We used to run these leaded with none of these issues. Basically we are not getting more than 25% hole fill on these parts. I have tested di
Electronics Forum | Wed Nov 07 13:36:20 EST 2007 | jdumont
Hello all, we are having issues with some specific package type aluminum caps we use while running lead free. We used to run these leaded with none of these issues. Basically we are not getting more than 25% hole fill on these parts. I have tested di
Electronics Forum | Thu Nov 08 12:05:05 EST 2007 | jdumont
Hole size may not have been an issue for you because your holes were already big enough? The alloy you are using has a lot to do with this I believe also. We are already at 5 seconds dwell for this which is mfg recommended for our solder. The caps we
Electronics Forum | Fri Nov 09 07:40:07 EST 2007 | jdumont
Thanks for all the great suggestions guys. We do not have topside heating but topside temps are where they should be before hitting the wave. No excessive copper in the area either. We are going to start with the most problematic board and use it as
Electronics Forum | Fri Nov 09 10:45:56 EST 2007 | pr
Being a hypochondriac and a pus*y, you would probably go to the emergency room if you EVER got grease on your hand (some skin disease). So your input on what a tech. (or anyone else who might happen to turn a wrench, leave the computer or actually wa
Electronics Forum | Mon Nov 12 07:59:38 EST 2007 | ck_the_flip
N ot another thread on PCB support! O f all the topics, this one has been much repeated. T o each his own, i guess for brining up this H eck, this topic is almost as repeated as stencil cleaning. E ngineers SHOULD be hands on, I agree. No
Electronics Forum | Mon Nov 12 08:04:15 EST 2007 | samir
In my past life, I used a tooling plate by JNJ that is specifically made for MPM's. The theory is - it's an alphanumeric grid, like Battleship, where you figure out your setup once, and then document it. It worked with and fit nicely with the MPM H
Electronics Forum | Thu Nov 08 06:12:03 EST 2007 | mattkehoe
Can someone point us in the right direction? We are trying to find a formula to determine the "cubic mils" of solder we end up with after reflow. (No components during the reflow) Some of the discussions we've had about it produced the thoughts bel
Electronics Forum | Thu Nov 08 08:41:15 EST 2007 | mattkehoe
Wow, that is a lot of info so early in the morning. What we are attempting is way less complicated than all that. 1 surface mount footprint, printed and reflowed without a component. Just a fused solder deposit on each pad. All pads the same size
Electronics Forum | Thu Nov 08 10:26:12 EST 2007 | slthomas
"1/2 of the paste volume is lost from the flux and carriers being removed during the reflow." Don't forget the intersticial space between your solder spheres that you lose during reflow. Not being of an engineering background I couldn't begin to a
