Electronics Forum | Tue Aug 28 16:41:42 EDT 2001 | davef
Very few concern themselves about the strength of solder connections, because it doesn�t require much strength to keep a solder connection attached to the board. More important are factors that arise as a result of the different materials properties
Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand
Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.
Electronics Forum | Wed Sep 05 08:50:04 EDT 2001 | davef
No arument with others comments about moisture, but taking a different tact, consider that the volitle elements of the solder paste disppear as a function of the amount of time the paste is out of the container. [Maybe as a function of solder paste
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef
On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].
Electronics Forum | Mon Oct 22 17:37:51 EDT 2001 | davef
I�m aware of no such standard. There may be something in Euroland [ie, IEC, etc.] TM-650 �Test Methods Manual� has procedures for measuring various types of contamination, such as: * 2.2.25 �Detection Of Ionizable Surface Contaminants� * 2.2.27 �Cl
Electronics Forum | Wed Oct 24 14:06:37 EDT 2001 | mparker
If you let your design team leave things up to chance, chances are something will go wrong. You are right to want to take control rather than be lead down an undesirable path by the fab house. Various masks serve certain desirable purposes. You need
Electronics Forum | Wed Oct 24 18:09:44 EDT 2001 | davef
Allowing the board fabricator to define the board you expect to receive is fine, as long as they do a good job. Regardless of the existence of a clear product definition or not, it�s reasonable for you to argue that your receipts must meet the requi
Electronics Forum | Tue Nov 06 18:39:08 EST 2001 | MikeF
Also, check the website for Assembly magazine, http://www.assemblymag.com, they have some good information on the basics of torque. Determining the "correct" torque value can become very complicated very quickly. The same size screws made from differ
