Electronics Forum | Thu Sep 17 07:06:15 EDT 1998 | joakim fagerlund
We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material is Au/S
Electronics Forum | Thu Sep 17 01:44:42 EDT 1998 | Robert Murphy
| Gentlemen, | Can anyone provide information on selective soldering systems that compete with Ersa's VersaFlow? Does anyone have experience with this machine or other machines of this nature? | My company is considering acquiring to increase techn
Electronics Forum | Fri Aug 21 17:16:11 EDT 1998 | Wayne Bracy
| | Steve: | | Take a look at the attached url. As with all testing systems, tooling / fixturing is costly. But, not as bad as a bunch of "Bed of Nails" test fixtures. | | Glad you had one of those great weekends, had to spend mine fishing,, again
Electronics Forum | Mon Oct 19 17:43:12 EDT 1998 | John Gregory
Ryan - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Oct 19 17:45:25 EDT 1998 | John Gregory
Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
Electronics Forum | Thu Jun 25 12:45:37 EDT 1998 | Steve Gregory
Hi there Chris! Are the leads you talking about fine pitch? Is the complete fillet attached to the foot, with it being cleanly separated from the pad? I bet if you look at the board there will be via's really close to the pads at the locations wh
Electronics Forum | Wed Jun 24 20:06:42 EDT 1998 | Dave F
| Hi all, | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process termin
Electronics Forum | Thu Jun 11 09:34:11 EDT 1998 | Mike Moninger
I'm surprised there hasn't been a response to this. This technique has been around for some time, as it was used early on for memory boards and the like. The pins come on a reel with a carrier strip or strips. Machines are available from the manufact
Electronics Forum | Fri May 22 10:41:54 EDT 1998 | Cunli Jia
| When you say "digital form" do you mean digitized like a jpeg format or a big ol' pile of electrons like a *.doc format? Anything that is already on disk will be fine. It will be ideal if the whole article is already in .cfm with reasonably sma
