Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice
I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work
Electronics Forum | Thu Sep 06 03:43:00 EDT 2018 | cmchoue
Dear Experts, Have any paper or data talking about the design guideline for avoiding BGA solder bridge? I desire to know the rule(guideline)that compare difference stencil thickness and safe solder design distance (air gap) can avoid bridge.
Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper
Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra
Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue
Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he
Electronics Forum | Thu Sep 06 05:43:15 EDT 2018 | cmchoue
Thank you Mr.Spoiltforchoice, My question is not clear , let me show you a photo Did you have any suggestion? Thanks James
Electronics Forum | Thu Sep 06 11:24:56 EDT 2018 | davef
pdf "BGA Stencil design guideline for avoid bridge" As you would expect, Google found 40,000+ results in less than a second One of my favorites was Power Point Presentation by Greg Smith [gsmithATfctassembly.com] at FCT Assembly: "Improve SMT Assem
Electronics Forum | Fri Sep 07 04:19:59 EDT 2018 | spoiltforchoice
You have lost me, its a stencil, you can change the aperture size, you can change the thickness and you can change the walls of the aperture. And all of those things will be in the papers anyone can find with a google. I have no clue what safe air g
Electronics Forum | Mon Oct 18 09:41:56 EDT 1999 | Wolfgang Busko
That should not happen. There are some threads concerning BGA and wavesoldering you could look for. It�s said that you should protect the vias in the BGA-area by soldermask or at least with tented vias to prevent rereflow of BGAs solderjoints what co
Electronics Forum | Mon Oct 18 05:31:38 EDT 1999 | Mattias
Does anyone have any experience of popcorning BGA�s in wavesoldering?
Electronics Forum | Mon Dec 30 13:52:50 EST 2002 | bcceng
Haran, This problem can also be caused if the BGA package is POPCORNING. Popcorning causes the BGA package to expand below the die, seen this happen so often to customers that try to install BGA's themselves without the proper handling of BGA's. Tha
