Electronics Forum: be1 (Page 1 of 3)

Quad IVc Fiducial Alignment

Electronics Forum | Fri Feb 24 13:21:42 EST 2012 | bobpan

The correct sequence steps should be: 1. tep hold 2-? pick/place/nozzles tep vpass goto 1 This is out of the programming manual.

Tombstoning 0306's

Electronics Forum | Fri Sep 09 10:43:58 EDT 2005 | ???

sounds like the part is being picked up on its side....which means.......it could be.... 1. pickup not taught correctly -- X-Y- or Z 2. head to camera calibration is needed 3. or least likely....feeder problems

Humidity & Temperature Range on SMT SHopfloor

Electronics Forum | Fri Aug 23 14:15:02 EDT 2013 | charliedci

I would think the two main issues would be: 1)humidity too low affecting static control issues. 2)humidity too high affecting moisture sensitive components. Otherwise I agree with Evtimov, whatever equipment/personnel can handle.

Having issues placing 0603 components on my used Juki 740...

Electronics Forum | Tue Jul 12 10:41:35 EDT 2016 | bradholland

oh i did not enter the pcb thickness. it is set to 0.0 I thought this was only to be changed for non standard pcb thicknesses. So, with the pcb being 1.6mm this is probably the answer. I guess this means I'm dumb..

Samsung CP 45 NEO, servo motors

Electronics Forum | Fri Mar 08 05:44:40 EST 2019 | bukas

are you sure #1 and #6 are interchangeable? if I remember correctly there is a catch with those motors, like there are 2 groups, group 1 being #1 #3 #5 and group 2 being #2 #4 and #6. maybe try getting it back and swapping cables at drivers for head

Re: Found solder bridging under SMT Chip of Wave process

Electronics Forum | Tue May 23 15:01:24 EDT 2000 | A. Marques

Hello, I think the problem can be: 1.�- some humidity in the adhesive, 2.�- some bubble of air in the adhesive when you cured the adhesive some humidity will go evaporate and when you make the soldering the same soldering will make a bridge between t

Re: DOUBLE SIDED SMT ASSY

Electronics Forum | Thu Oct 28 04:52:27 EDT 1999 | Paul Gerits

Hi Jerry, normal proces would be; 1st. reflow side (top) 2nd. curring side (bottom) 3rd. insert 4th. solderwave Reason for this is that you have a better handling and no overdue stress to components in case you do bottom before top. It is also eas

Copper Finishes versus Layer Thickness

Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House

Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y

Re: Fuji MCS/2 vs. F4G

Electronics Forum | Wed Feb 10 02:09:07 EST 1999 | zeek

| Any thoughts from FUJI users on the likes and dislikes (pros and cons) of MCS vs. F4G , and vice versa? | | Likewise, are there any "FujiCAM" users out there who would like to comment as well? | | Thanks. | We have had some experience with both

Re: Fuji MCS/2 vs. F4G

Electronics Forum | Wed Feb 10 02:10:39 EST 1999 | zeek

| Any thoughts from FUJI users on the likes and dislikes (pros and cons) of MCS vs. F4G , and vice versa? | | Likewise, are there any "FujiCAM" users out there who would like to comment as well? | | Thanks. | We have had some experience with both

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