Electronics Forum | Thu Feb 27 12:23:47 EST 2003 | woodsmt
James, Have you considered going to a No-clean process? BGA's can be difficult to impossible to clean using an aqueous process. The water just won't penetrate under the entire BGA and efficiantly remove your flux residues. The tighter the pitch
Electronics Forum | Tue Apr 01 08:59:06 EST 2003 | rdr
Hi all, I've got a question that hopefully someone can provide insight. We have a gold immersion assembly that we believe is experiencing fractures or non wetting on a certain BGA. To be sure that it is a fracture and not a wetting issue I would li
Electronics Forum | Wed Apr 09 11:23:02 EDT 2003 | davef
Nice pix. The pebbly texture that you're seeing is aptly called "orange peel". Temperature appears to significantly influence the appearance of solder spheres during soldering. Indeed, when the reflow temperature is high, tin continues smelting long
Electronics Forum | Wed Jul 09 04:57:11 EDT 2003 | Matt Kehoe
Our company applies solid solder to surface mount lands. While processing a micro BGA design we had some pads fall off, peel, whatever you might call it, from the surface of the board when touched "GENTLY" with the tip of a blade to remove a small s
Electronics Forum | Fri Aug 22 10:11:52 EDT 2003 | Stephen
An asteroid the size of texas is more likely to hit the earth than to get a BGA with one ball at the absolute max and another at the absolute minimum. The manufacturer is going to give themselves some leaway. What are you going to do about the more
Electronics Forum | Fri Jan 16 07:06:47 EST 2004 | Mika
Component manufacturer often have recommendation for pad layout and process setup. This should be used as a guideline to help You to set up the process. Exactly what type of component is this, uBGA? We populate 64 I/O uBGA's on our pcb's with 0.3 mm
Electronics Forum | Tue Apr 13 21:33:48 EDT 2004 | qualitel
Hi Dreamsniper, It seen this is the major issue had been occurs you.( We had face all this issue last time too) We had done a lot of areospace products before and most of ours products is a must on class 3 spec. BGA is not that tough t
Electronics Forum | Tue May 04 16:43:41 EDT 2004 | russ
So the only difference between the "regular solderers" and the BGA people is trace repair? If that is it than you should put the pay in range with your PCB repair people. We do not pay any extra for BGA rework since all they do is wick pads (common
Electronics Forum | Sun Jun 13 07:57:15 EDT 2004 | Grant
Hi, We have been offered some lead free BGA parts in place of normal lead solder BGA parts in our process, and because we can get them faster it would be a good option. However does anyone know if we can use them as normal. I assume the balls won't
Electronics Forum | Mon Jul 19 09:53:07 EDT 2004 | Mighty C
Good Morning Rush Fan, We have a Metcal VPI 1000. We are very happy with the system. The price is competitive, software is easy to use and the picture quality is good. They have a great lighting scheme that illuminates under a BGA extremely well. Th
