Electronics Forum | Wed Nov 21 09:19:09 EST 2007 | Paul M.
Need some opinions from you fine folks. We are building assemblies 90% SMT, 10% TH. Fine pitch and BGA devices, etc. The customer is complaining about cold solder joints (SMT) after about 1 year of use, scattered thru-out the assembly, not consistan
Electronics Forum | Tue Dec 04 09:46:50 EST 2007 | pms
Thanks for all your suggestions. I like the BGA replacement pad option the best. Reprogramming/programing? Forget it. That's what I'm trying to avoid. I'd be there all friggin day long, with all the loser "Labor Only" accounts we have. And oh, the p
Electronics Forum | Fri Dec 21 00:06:55 EST 2007 | nhantruong
If you want to use fuji CP6 machine, you have to buy the the fuji flexa software.Because the old software from fuji (MCS or F4G) they are not support anymore. In the flexa software you can make top and bottom side in the same program, you can move th
Electronics Forum | Mon Jan 21 19:10:29 EST 2008 | hegemon
The APE machines are still OK in their place. We still have two APE machines that are over 8 years old and still are good for some processes, but have been consigned to the leaded solder rework area. We have upgraded to AirVac since the advent of le
Electronics Forum | Thu Jan 31 11:53:55 EST 2008 | dphilbrick
Profiler is a MUST, along with at least one board you can scrap. Permanently attach TC's and use it to monitor your oven. You really shouldn't use it more than 5 or 6 times before getting a new one but if you can't understand your reading might be of
Electronics Forum | Fri Feb 22 14:22:07 EST 2008 | stevek
Are you using nocleans, especially when you get to SMT? Years ago, I had OA wave flux get into vias that were plugged from the top under parts. It is really difficult to clean small, high aspect ratio vias. Cross sections showed that the copper in
Electronics Forum | Tue Feb 26 05:10:17 EST 2008 | adetuc
Thanks for the reply Hege, I calibrate the machines every 3 months and have checked that the board carrier to nozzle parralelism is ok. Have tried many different profile settings using a MOLE for readings but still collapsing on one corner. I did
Electronics Forum | Tue Feb 26 10:27:12 EST 2008 | hegemon
We have both DRS24 and DRS25 here. I think you will be much happier with the DRS25 as the underboard heating is superior, of course after a year of using the 25, it has its caveats as well, though minimal. I was a little surprised that you are havin
Electronics Forum | Fri May 02 16:20:35 EDT 2008 | rwyman
We've never, to my knowledge, sent out Pb-free BGAs to be reballed for use on an SnPb assembly. In fact, we developed an in-house reballing process and we haven't felt the need to do that either (for salvaging an occasional reworked part, maybe).
Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
