Electronics Forum: bga and fuji (Page 8 of 60)

Design and manu.

Electronics Forum | Thu May 26 00:42:19 EDT 2005 | nicholas2005

Ok, I just need someone to give me some feed back on a few questions I have. If anyone could help me that would be great. Example: take a Fuji CP-4 feeder for instance! If I machine my own, place my own parts on it, and place my own company name, and

SMT optimization and improvement

Electronics Forum | Thu Jun 01 04:51:21 EDT 2006 | EC

Hi TS, Most of the machines will face this problem after been using few years.....I handling SMT equipments ( Fuji machine ) and process.....sorry if I have offened you...... Hi Jack, Firstly, you must able to tell which component having a high thr

High-end SPI and AOI?

Electronics Forum | Tue Oct 13 22:56:22 EDT 2009 | cpcompany

Can anyone help me recommend or simulate a SPI > and AOI machine that can balance our FUJI NXT 1 > with 14 modules. We are using MPM accela printer. > 200 UPH is our target. > > Here's the PCB > dimension > > length(x) = 399.92mm width(y) = >

BGA assembly and inspection

Electronics Forum | Mon Apr 02 17:16:22 EDT 2001 | kward

Try IPC-7095. It is not free , but discusses in-depth Design and Assembly Process implementation for BGAs. Website is ipc.org

BGA and Land Patterns

Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank

BGA lands and ICT

Electronics Forum | Wed Mar 20 15:18:09 EST 2002 | angiewest

You may want to check out IPC-SM-782 "Surface Mount Design and Land Pattern Standard" http://www.ipc.org Good Luck

0201 and uBGA

Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef

Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?

Dye and Pry Process

Electronics Forum | Fri Apr 01 23:32:39 EST 2005 | ccgooi

Hi, I would like to understand more about dye and pry process for BGA assembly. Can anyone provide me more information about reference about this topic.Thanks.

Dye and Pry Process

Electronics Forum | Sat Apr 02 07:26:47 EST 2005 | davef

It's used for BGA 'disassembly'. Look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=32271

Flexi boards and uBGA

Electronics Forum | Thu Jul 06 12:06:12 EDT 2006 | pavel

Rob, do you have any tip on reliable supplier of "really flat" flexible pcb? We tried several but all with issues. Thank you. Pavel


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