Electronics Forum | Mon Dec 05 08:51:56 EST 2005 | whipping post
no one else has seen this?
Electronics Forum | Mon Dec 05 17:03:15 EST 2005 | russ
Ina ddition to the above it can be from CTE mismatch and the joints are breaking during cooling. Is this an Altera part?
Electronics Forum | Mon Dec 05 09:31:19 EST 2005 | whippingpost
Not all but some were tested O.K before the failure. What are some of the other reasons for ball separation from the component body besides mechanical stress?
Electronics Forum | Tue Jul 25 11:30:47 EDT 2006 | DC
Russ, we had similiar issue on the corner seperation. The board is ENIG and the part is Altera FBGA 1020 (Super BGA) and reflowed by tin/lead paste. Please comment your concern on Altera parts! Is CTE mismatch?
Electronics Forum | Mon Dec 05 09:22:34 EST 2005 | russ
I'm sure that we have all seen it but it can be from so many different things. Definitely can be from flexing, Are you 100% sure that they are good prior to this install remove process?
Electronics Forum | Mon Dec 05 12:41:40 EST 2005 | stepheniii
thermal cycling chemical reactions (can occur slowly) they were only touching before and not really a solid solder joint
Electronics Forum | Fri Dec 02 09:51:05 EST 2005 | whippingpost
I have an assembly that uses several different BGA packages. During troubleshooting we have found that some of the balls in the corners of the BGA's are separated from the underside of the package. The PWA is approx 10�x10� and the components vary fr
Electronics Forum | Mon Dec 05 12:57:59 EST 2005 | Billy D
Dude, make sure you're not getting too hot, too quick. If the BGA "dogears" in the oven, or during a rework procedure, it'll either short, or get very strained, depending on which way the part moves, up or down. Also, bake the hell out of them, as if
Electronics Forum | Tue Jul 25 12:14:39 EDT 2006 | russ
All my studies led me to believe that it was CTE mismatch of this package. Altera was of less than 0 help in this matter. The other possibility was an ICT test fixture. Unfortunately (?) the design life of this product was at end and the new design
Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton
We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac
