Electronics Forum | Fri Mar 04 01:08:19 EST 2011 | kemasta
Thanks davef Bridging:- There is no heat sink on the BGA, the heat sink will be fix after relow. I do believe paste had something to do with it, but currently this defect didn't appear so oftenly, so we think that the main root cause is not from the
Electronics Forum | Mon Mar 21 02:54:58 EDT 2011 | kemasta
Hi Dave I agree with the 2nd point (sloppy process management) if the failure rate is higher than 5%. But this is 0.083% case, and only happen once in the blue moon. As I study about the re-flow profile for the last whole week, current parameter se
Electronics Forum | Thu Mar 03 14:05:49 EST 2011 | davef
Certainly the bridge is ugly, but the voiding is nothing that you should be bragging about either. Pretty ugly work. BRIDGING: If all of your shorts appear in the vacinity of the heat sink, consider reducing the amount of paste that you apply there.
Electronics Forum | Wed Aug 18 16:26:21 EDT 1999 | Tony
Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. This is what I did. Created a removal profile, I had a board
Electronics Forum | Wed Jan 16 22:57:52 EST 2008 | amarpreet41
Any one got experience on handling solder bridging under one corner of BGA?
Electronics Forum | Wed Oct 03 17:06:43 EDT 2001 | davef
Yes, moisture entrapment causes solder shorts 80% of the time. Cracks occur bottom side of the BGA. Use an acoustic microscope to find the cracks. So, what makes you think your BGA are blowing-off steam? I posted a vid on SMTnet that showed the b
Electronics Forum | Thu Sep 06 03:43:00 EDT 2018 | cmchoue
Dear Experts, Have any paper or data talking about the design guideline for avoiding BGA solder bridge? I desire to know the rule(guideline)that compare difference stencil thickness and safe solder design distance (air gap) can avoid bridge.
Electronics Forum | Wed Sep 02 06:50:55 EDT 1998 | Masdi Muhammad
Hi, We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it. Than
Electronics Forum | Wed Aug 18 21:26:08 EDT 1999 | Dave F
| Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | This is what I did. | | Created a removal profile, I h
