Electronics Forum | Mon Jun 17 09:52:33 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus
| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent
Electronics Forum | Wed May 21 09:31:09 EDT 2003 | caldon
I need to first understand what "Peeled the BGA off" means. Was heat used? was this the pry and lift method? We had shorts under some BGA's we have and the solder was bridging from lead to lead but not on the board level at the FR4 on the BGA creati
Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice
I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work
Electronics Forum | Thu Aug 21 09:34:57 EDT 2003 | davef
Woa. The more paste that you put a a BGA ball, the more likely that you'll bridge between balls. Why do you need to compensate for the size variance in BGA balls? How does using a 8 thou thick stencil to compensate for ball size variance? Fine pi
Electronics Forum | Wed Jun 11 18:22:41 EDT 2003 | Steve
Do you happen to know where I may find a supplier for the "little mirror"? Google didn't produce relevant search results for Mentor. My method of inspecting possible bridging under a BGA involved a small flashlight placed up against the edge of the
Electronics Forum | Tue Aug 05 05:27:53 EDT 2014 | philc
Another interesting response! The PMTech machine looks interesting, but I doubt we will get clearance to spend this amount for a machine that doesn't get used several times daily. I wonder how much the Blundell machine is? Anyone have a costing for
Electronics Forum | Sat Aug 07 17:27:00 EDT 2004 | celldude
We use ssd on all components, from 0201 to very large fine pitch and bga's. With some very small micro bga's , if there is a problem with bridging, we will tape off the stencil during the ssd process and just use bare pads...along with the solder fr
Electronics Forum | Tue Sep 20 17:09:14 EDT 2005 | hly
I have a situation with hot boards with fine pitch BGAs that I need to build. However, there is a big problem--the auto screen printer is down. I decided that we would use the stencil and manually line up the pads and do a manual print. I can't ac
Electronics Forum | Fri Sep 07 04:19:59 EDT 2018 | spoiltforchoice
You have lost me, its a stencil, you can change the aperture size, you can change the thickness and you can change the walls of the aperture. And all of those things will be in the papers anyone can find with a google. I have no clue what safe air g
