Electronics Forum | Thu Apr 25 05:17:08 EDT 2019 | pdrirrework
Hello All, Using IR will mean that there is no minimum distance to the adjacent components as there is not hot air flow. If components are heat sensitive around the BGA you can also tape them off with a reflective tape. The IR heat will bounce strai
Electronics Forum | Tue Feb 05 16:06:48 EST 2013 | mlevesque
We are looking for a new BGA rework station. We got an ERSA IR550A and we are not very satisfied. I'm not sure that IR reflow is the better solution because the top-side heating is too large. I think is better with a convection "forced-air" heat.
Electronics Forum | Thu Jun 17 20:57:44 EDT 1999 | Earl Moon
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Mon Aug 03 17:15:56 EDT 2020 | rgduval
In general, no. If you've got the right BGA rework equipment, you should be able to locally heat the part area that you're reworking. Though, if you're finding defects related to thermal stress, it might not be a bad idea to pre-heat the rest of th
Electronics Forum | Mon May 12 16:31:39 EDT 2008 | tsvetan
Hi, there are different BGA packages, it's not same to rework LFBGA with 0.5 mm step and BGA with 1.27 mm step for instance basically you will be able to de-solder the BGA with hot air and proper nozzle which distributes the heat even on the BGA pa
Electronics Forum | Mon Jan 18 14:01:47 EST 2010 | cl
Good Afternoon, Is this by chance a Pb BGA on a RoHS board? We had an issue with a Pb BGA on a RoHS board where we experienced "ball drop" on the Pb BGA. This was due to the heat required to reflow the RoHS paste. It was more than the Pb BGA could
Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob
I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.
Electronics Forum | Tue Aug 25 07:13:20 EDT 2009 | davef
It sounds like the BGA balls are not melting. You're probably getting no collapse. Put a bare BGA on a hot plate. Heat it up until you get collapse. Adjust your reflow profile until you have that temperature on the BGA pads on the board. What is the
Electronics Forum | Wed May 25 15:40:27 EDT 2005 | james
Has anyone had good luck with the reflow on these extremely heavy bga's. This bga has 1517 balls and requires alot of heat because of the thickness of the part. Just wondering if anyone out there can help me.
Electronics Forum | Tue Oct 05 14:06:26 EDT 2021 | oclsc
Hi SMTnet. It is possible to reflow BGA's 0.65 pitch with a convection oven that only have heating zones on one side (topside) or is it a must to have heating zones on both sides in the oven (top and botton). Regards Ole C. Denmark
