Electronics Forum: bga pad sizes (Page 1 of 208)

stencil thickness for bga

Electronics Forum | Mon Oct 13 19:04:47 EDT 2003 | davef

Aperture size should vary with the component [pitch]. That size should be the same a the pad size. So, generally pinching is not required. Indium discusses BGA apertures on their site [ http://www.indium.com ]

Standard pad sizes for reflow and wave

Electronics Forum | Thu Sep 02 21:02:55 EDT 1999 | Paul Wareham

We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes?

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef

We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Mon Aug 25 10:36:05 EDT 2008 | davef

Yes, it's peculiar that the layout of this board is so disorganized * Pads are not round, uniform, or the same size * Exposed traces have different thickness

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr

Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads

HELP!! via sizes location

Electronics Forum | Tue Oct 05 10:13:48 EDT 1999 | Frank Fossett

I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer wants to use an .035 pad with a .012 dia. hole, there are no via's under the zero clea

pad cratering

Electronics Forum | Wed Jul 01 04:54:28 EDT 2015 | jvercamm

hi, the last post on pad cratering dates from 2012. We have (likely similar) problems with a RoHS 783 solder ball BGA size 29x29mm^2 (organic package BT), pitch is 1mm and solder ball diam is 0.5mm the field failure is after 12 months, almost exclu

BGA pad size

Electronics Forum | Tue Jun 14 15:18:13 EDT 2005 | jdumont

How do I send pics....sorry for the ignorance.

BGA pad size

Electronics Forum | Tue Jun 14 14:18:56 EDT 2005 | davef

Send the vacation pix, pls

BGA pad size

Electronics Forum | Tue Jun 14 20:03:06 EDT 2005 | davef

click on the email link, next to the Lou Reed icon, then paste the pix in the form

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