Electronics Forum | Wed Jan 17 07:55:11 EST 2007 | pavel_murtishev
Vladimir, Phil J is right. Tantalum�s moisture vapor outgassing is the root of the problem you are searching for. Internal pressure of entrapped moisture becomes very high in reflow zone. Vapor jet shifts your components and affects BGA�s bumps. Bak
Electronics Forum | Tue Nov 20 20:58:43 EST 2001 | davef
Very coo!!! [You have done an outstanding job of describing your situation.] I guess the via are connected to a BIG chunk of copper that affects your profile on that pad / ball. At the same time, run a profile each on a: * Void pad * Nonvoid pad
Electronics Forum | Mon Jan 13 16:24:15 EST 2003 | russ
Youch! I know this is going to sound stupid but.... I have done it in the past in limited quantities. We placed capton (polyimide) tape at each of the four corners for a similar situation. It did work but the operator has to be careful in placing
Electronics Forum | Thu Jul 29 11:14:46 EDT 1999 | Justin Medernach
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
Electronics Forum | Fri Nov 25 09:31:56 EST 2005 | davef
pyramus, First, search the fine SMTnet Archives for previous discussions on BGA shorts. Second, we're still not clear on the issue. * Is the problem with a BGA? If so, please describe the BGA, including any heat spreader * Is the problem with a uB
Electronics Forum | Tue Jun 19 19:03:31 EDT 2007 | diesel_1t
Hi folks. If the solder is on the BGA but is not soldered at all on the pads, then you can discard BGA solder issues, by the other hand; you might be experiencing wicking due to heat is being absorbed on component so the balls on BGA are hotter than
Electronics Forum | Wed Dec 07 16:01:45 EST 2005 | JP
I am attempting to reball some PBGA's with no luck. The problem is getting the solder spheres to sit in the stencil apertures and removing excess spheres. I apply light amount of flux to pads of a BGA, align a stencil over a BGA, then pour solder s
Electronics Forum | Wed Feb 10 08:37:31 EST 2016 | davef
bga hosed by physics ... to find some older threads on the topic BGA Bowing on the corners. - SMTnet [http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&Thread_ID=6405 ] www.smtnet.com › Electronics Forum • Aug 22, 2003 - 5 posts - 1 au
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
