Electronics Forum | Thu Aug 19 22:59:48 EDT 1999 | Jeff Ferry
| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad
Electronics Forum | Thu Aug 19 23:56:49 EDT 1999 | Earl Moon
| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the
Electronics Forum | Fri Aug 20 09:33:51 EDT 1999 | Don Morgenstern
Earl & Jeff Our machine is different than the Electrovert Solder Pak in that it is does not behave like a "volcano". Jeff, please contact me if you have safety concerns as perhaps you also want to consider our equipment. | | I'm trying a second ti
Electronics Forum | Fri Aug 20 13:00:16 EDT 1999 | ScottM
| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad
Electronics Forum | Thu Jan 29 19:01:51 EST 2009 | stevek
Allow me a contrary viewpoint. I've had these things on my floor and had customers get outsourced evaluations done with them. Most expensive boat anchors I've run across. First the good points: The automated scanning and pattern recognition is go
Electronics Forum | Fri May 14 12:13:35 EDT 1999 | Heather
| Hi Guys, | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | So, any of you folks who have already experi
Electronics Forum | Mon Jun 18 11:23:44 EDT 2001 | Gil Zweig
BGA defects observed with x-ray inspection fall into catagories. One catagory is the obvious defects; i.e. soledr bridges, missing balls, excessive solder voids. The second catagory is the more subtle "potential" defect. This is where variations in
Electronics Forum | Mon Jun 18 19:32:58 EDT 2001 | Gil Zweig
I believe that at the present time the industry really does not know how to use x-ray inspection apart from indentifying the obvious defects such as shorts, missing balls and gross solder voids. The real utility of x-ray inspection is to recognize: 1
Electronics Forum | Wed Jan 13 19:13:59 EST 1999 | Michael Allen
Just a comment: we've seen PBGAs curl up at the corners, but only on prototype components that came off of a low-volume "prototype" line at our component supplier's lab (non-production overmold material was used). Production parts have not exhibite
Electronics Forum | Fri Sep 19 11:49:54 EDT 2003 | chrissieneale
OK, so is anyone qualifying CGA's yet? Our first batch of CGA qualification is not going too well. We stuck with the teardrop shaped pad but the solder fillet is not as big as expected. What size pads is anyone using, i'm getting conflicting informat
