Electronics Forum | Mon Nov 11 10:29:37 EST 2002 | Yannick
Hi, I'm beginnig working with BGA and with test I made I see some Void in it. I know that IPc have something on it. But I would appreciate if someone who have a good knowkledge about it contact me at: yb@m2s.ca Or can you give me some hint t
Electronics Forum | Sat Mar 06 06:15:14 EST 2004 | Bryan
Thanks Tommy. In fact I've tried many types of profile,but it didn't work.I'll try to make the peak temp. as low as 205C and dwell long as in some threads Dave said.I've tried baking the BGA and PCB before mounting also dindn't work.yes,I've heard th
Electronics Forum | Mon Jan 22 20:54:55 EST 2001 | davef
IPC-7095 - Design & Assembly Process Implementation for BGA's Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. This document
Electronics Forum | Fri Aug 25 14:39:24 EDT 2006 | davef
1 When you peel the solder connection of a BGA, * If solder remains on the soldered surface [eg, component, substrate, etc], it's good. * If some solder remains and some base metal is present, it's marginal. * If no solder remains, it's NG. 2 Try I
Electronics Forum | Fri Jan 15 15:29:03 EST 1999 | Jason Hall
| Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | Regards | Ji
Electronics Forum | Tue May 02 07:46:39 EDT 2006 | Bob R.
Be careful about taking any generic advice and trying to use it to reduce voiding for your particular paste with your particular boards. I've done a few literature searches over the years on causes/cures for BGA voiding in the SnPb world and found a
Electronics Forum | Fri Nov 13 06:56:37 EST 2009 | CL
Good Morning, The customer is looking for void free connections. They had never specified an acceptable percentage. We are reacting to the test yield. Our yield has averaged 50%. We do not test the product so we rely on feeback from the customer. Us
Electronics Forum | Wed Jan 15 23:32:36 EST 2003 | tinson
How about section 12.2.12 of IPC-A-610C? It doesn't include detailed description of root cause/effect but acceptance criteria.
Electronics Forum | Fri Jun 04 08:33:44 EDT 2010 | karthikthebest
Hi, Just have a look at the tech sheet on VIP, looks likes a continuing story until IPC defines the criteria in a better way
Electronics Forum | Sun Feb 16 20:52:34 EST 2014 | staylorebad
IPC-4552 says it does. It specifically talks about ball grid array (BGA) pads so small feature size is included as valid. Scott
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