Electronics Forum | Thu Sep 05 11:05:35 EDT 2019 | SMTA-Tony
There are competitors to REL solder alloys from AIM. Tin-Copper-Nickel-Bismuth alloys (Nihon Superior) are an alternative option which do very well in thermal cycle testing. The reflow profiles required are similar to SAC305 profiles. You may als
Electronics Forum | Fri Jan 04 15:42:03 EST 2002 | nwyatt
There are several implications: - some lead free alloys do not form an acceptable solder joint when used with lead contaning paste. (ie. Bismuth) - if you use both lead free and lead containing components, you will have different solder joint compos
Electronics Forum | Mon Jun 27 09:09:19 EDT 2005 | Bob R.
We've all been soldering Pb free parts for a couple decades. All your surface mount capacitors have probably had a Sn finish for years. Whenever one of our parts with a SnPb finish converts for Pb free we have the manufacturing site do a small buil
Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band
I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi
Electronics Forum | Thu Jun 03 10:09:59 EDT 1999 | Earl Moon
| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann
Electronics Forum | Thu Jun 03 10:53:09 EDT 1999 | Ryan Jennens
| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca
Electronics Forum | Thu Jun 03 12:31:30 EDT 1999 | Dave F
| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We
Electronics Forum | Thu Jun 03 13:00:16 EDT 1999 | Earl Moon
| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We
Electronics Forum | Thu Jun 03 14:06:16 EDT 1999 | Dave F
| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca
Electronics Forum | Thu Jun 03 15:19:14 EDT 1999 | Earl Moon
| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We
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