Electronics Forum: bond dispenser (Page 1 of 4)

COB and wire bond

Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef

4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New

PANASONIC BD 12

Electronics Forum | Fri Sep 05 02:02:44 EDT 2003 | CALVERA

Hello, Do you have anybody experience with bond dispenser PANASONIC BD 12? We are losted calibration data from machine because machine was without power too long time. I am looking for advice how to regenerate machine. Thank you. CALVERA

glue dot size

Electronics Forum | Tue Dec 19 07:16:56 EST 2006 | Nuno

There is many Bond dispenser that have the Option to check the area & adjust in case of NG area . You just make the value of area & interval for check and correct . The Ones that I know is Panasonic HDF (great Output 0.07 tact time ) And Fuji GL5 ser

maintain glue size

Electronics Forum | Tue Dec 19 07:04:07 EST 2006 | Nuno

Hello Just a question . What is the Bond dispenser that you are Using ? Is the problem related to a specific nozzle & station or the problem are in all the stations ? Regards Nuno

DCA/Wire Bonding/Encapsulation

Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David

Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?

Bright surface mount led's?

Electronics Forum | Mon Jun 06 09:05:02 EDT 2005 | cmiller

How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni

Bright surface mount led's?

Electronics Forum | Mon Jun 06 10:02:39 EDT 2005 | cmiller

How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni

large smt inductors moving in the reflow oven

Electronics Forum | Mon Feb 22 10:01:01 EST 2010 | jtsyeung

Since the inductor is electro-magnetic, that means the device is composite of coil and ferrite metal. The inductor inside the reflow oven meets with blower motors which close to the inductor and generate magnetic field. With such conditions, Lawren

Connector is falling down in the second reflow

Electronics Forum | Wed Feb 12 02:38:02 EST 2020 | majdi4

Hi there , I agree with phil .. but we cannot change the architecture of the card to mount the connector on the 2nd side. Steve , we are producing large series, so we can't manually ship bond the connector .. for the moment, we cannot invest in a gl

Use of chip bonding adhesive.

Electronics Forum | Wed Oct 06 09:40:49 EDT 1999 | Mark Quealy

I have an adhesive dispenser in my workcenter but I rarely use it. I've replaced this process with wavesolder pallets for bottom side PTH soldering, ocassionally gluing parts left exposed by the pallet. So I was thinking of selling the dispensing equ

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