Electronics Forum | Tue Oct 26 11:15:55 EDT 1999 | Morris
I am evaluating a bottom side glueing process. I was wondering if anyone could share their shear force specifications, or how they were developed. I would be most interested in the 0805 and Sot23 package types. Also, does anyone know if heating the
Electronics Forum | Mon Dec 28 14:59:36 EST 1998 | Earl Moon
| How does flux residue effect the quality and reliability of the board. This is part of our spray fluxer evaluation. One of the our concerns is spots of residue on the bottom side. Any input or reference to links on web will be greatly appreciated.
Electronics Forum | Wed Sep 23 20:21:16 EDT 1998 | p. palshikar
i am working on a no-clean process implementation project in a company. i want to change a board to no-clean which had dendrite problems underneath the small resistors on the bottom side(in smt).i want more information on the exact cause of dendrites
Electronics Forum | Wed Jun 17 14:45:45 EDT 1998 | Bob
| Does any one wave solder the 0402 Chips on the bottom side of a board? | Any comments? You will need to use a curable epoxy at the site of placement before placing the 0402--then cure the epoxy...possible problems are epoxy intrusion on the lands
Electronics Forum | Wed Jun 17 16:00:47 EDT 1998 | Frank
| | Does any one wave solder the 0402 Chips on the bottom side of a board? | | Any comments? | You will need to use a curable epoxy at the site of placement before placing the 0402--then cure the epoxy...possible problems are epoxy intrusion on the
Electronics Forum | Fri May 08 16:33:46 EDT 1998 | Chrys
| As usual, we are faced with too many components and not enough board on a new design. Does anyone have experience wavesoldering .025" pitch TSOPs on the bottom side? | Any advice is appreciated. | Greg Sounds scary, particularly from a reliability
Electronics Forum | Wed Aug 15 17:30:43 EDT 2001 | peterson
Hello All, We have an MPM 2000 screen printer. My question is this: we are having a stencil made that has both top and bottom side on a single foil. Our Process people are unsure if the machine parameters will allow it. The board size is 19x15. Can i
Electronics Forum | Tue May 14 11:52:04 EDT 2002 | Claude_Couture
Excuse me, but if I remember my physics lessons well, volume is what the water displacement measures, not mass. therefore, if you take the volume of water displaced by your populated PCB, divide it by the thickness of the PCB (which is easy to measur
Electronics Forum | Thu Jun 20 19:27:28 EDT 2002 | surinder
Hi Dave, I am agree with you,but one of my customer want to know the difference in terms of rework/Quality,if we go for Glue process in place of solder paste and want to see some data We have board ,which have Through hole components and smt comp. on
Electronics Forum | Tue Oct 15 15:16:34 EDT 2002 | Abelardo Rodriguez Santana
We run into that issue all the time. If a corrective action must be done right away. Place Kapton tape on the bottom side of the board to cap off the via. If you have room to place tape if not use pink lady or something to plug the via. And weathe
