Electronics Forum | Fri Apr 24 17:13:25 EDT 1998 | Glenn Eubinag
Sounds like your running older equipment earlier than the latest C series machines. If you are, the older Quad machines only vacuum verify at pick, not during transit to the placement location. Make sure that your vacuum setting is correct. Nozzle
Electronics Forum | Wed Apr 15 23:30:27 EDT 1998 | Scott McKee
| Wondering if anyone has information on percentage of components that we | can expect to "lose" during our SMT process. We are new to SMT, using | QUAD machines and feel we are losing to many parts during our process. | We are spending a lot of tou
Electronics Forum | Wed Apr 15 15:04:18 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Wed Apr 15 14:57:20 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Wed Apr 15 14:53:06 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Mon Apr 13 08:47:09 EDT 1998 | Bob Silveri
| | | | | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no
Electronics Forum | Mon Apr 13 12:11:41 EDT 1998 | Justin Medernach
| | | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusiv
Electronics Forum | Thu Apr 09 13:57:33 EDT 1998 | Mike C
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Thu Apr 09 14:05:54 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Tue Apr 07 17:17:46 EDT 1998 | Steve Gregory
| I was at the Southcon show in Orlando and saw a PCB depanelization machine which was basically a rotary saw which cut through the scoring on the panel. I don't remember the name of the company though so I can't get any info on this. Does anyone k
