Electronics Forum: capability selectiv soldering (Page 1 of 60)

Current capability

Electronics Forum | Wed Mar 01 09:34:13 EST 2000 | Sorin

HELLO, Do anybody know if is existing an empirical rule that can show me how many amps can carry a plated through hole with a diameter of x.xx millimeters? Is there a formula depending on X.XX value that could help me to make such calculations? How

Current capability

Electronics Forum | Wed Mar 01 09:34:13 EST 2000 | Sorin

HELLO, Do anybody know if is existing an empirical rule that can show me how many amps can carry a plated through hole with a diameter of x.xx millimeters? Is there a formula depending on X.XX value that could help me to make such calculations? How

Solder paste height capability

Electronics Forum | Tue Aug 04 03:54:04 EDT 2009 | rafacadiz

I would like to perform a Solder paste height capability study. I will apreciate any info about and what equipment use to measure the height of the solder paste. I only found the attached equipment. Solder Paste Height Measurement System (SPM-300-3D

Solder paste height capability

Electronics Forum | Tue Aug 04 06:49:12 EDT 2009 | davef

solder paste inspection SMTnet => search the fine Archives

Wave solder capability study

Electronics Forum | Thu Jul 17 14:30:42 EDT 2008 | tommyg_fla

1500 lbs) vary by a couple of degrees) were standard. I thought that flux penetration into PTH barrel and solder pot immersion depth and solder pot parallelism would be also critical factors. We are using the ECD WaveRider to measure the implied sold

Wave solder capability study

Electronics Forum | Thu Jul 17 20:20:12 EDT 2008 | davef

Wave set-up DOE * Immersion depth [1/3 to 2/3 of board thickness] has the least impact of any variable in wave soldering. * Contact length the greatest impact. * Control flux density, time through preheaters, top side temperature as the board reaches

Wavesoldering capability study

Electronics Forum | Thu Jul 05 10:11:19 EDT 2007 | ck_the_flip

The variables to study: * Dwell Time * Contact Length * Conveyor Speed * Parallelism * Top-side Substrate Temperature Before wave * Solder Pot temperature All of these variables are inter-related (ie changing one variable will affect another)

Solder paste height capability

Electronics Forum | Tue Aug 04 13:59:51 EDT 2009 | ck_the_flip

Is this topic on Wikipedia, Facebook, or MySpace as well?

Solder paste height capability

Electronics Forum | Tue Aug 04 22:57:07 EDT 2009 | davef

Wikipedia: http://en.wikipedia.org/wiki/Automated_optical_inspection Facebook: http://www.youtube.com/watch?v=So_DMNGZHAQ

Wavesoldering capability study

Electronics Forum | Thu Jul 05 00:23:50 EDT 2007 | reypal

Im not sure if someone has posted this topic before. Anyway,we plan to make capability study on our wave-soldering machine but we have no experience on how to do it effectively. My question is what we should consider most among the critical parameter

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