Electronics Forum | Wed Oct 17 09:19:23 EDT 2007 | actech
This box has the I/O card mounted sideways under it's own cover on the side of the main box. The CPU card is the bottom card. The Two driver cards X/Y and R/Z are side by side and mount to a steel base pannel with there relays at the back. but even i
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
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