Electronics Forum | Tue Aug 11 09:52:53 EDT 2015 | rgduval
I assume that these parts are falling off during second-side reflow? The easy solution, of course, is to not build high-mass components on first-side reflow. If this isn't practical, however, you can try using epoxy/glue under the component. We'
Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef
You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder
Electronics Forum | Tue Aug 11 09:48:22 EDT 2015 | samputrah
We have had two jobs that have the same issues with DPAK's sliding off their pads during reflow. We tried to resolve this by placing epoxy on the side of the component to create a "dam". However this is not repeatable enough to be a quality resolutio
Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup
| | | Has anyone had any experience or data using vibration during the reflow process. | | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process
Electronics Forum | Mon Dec 03 15:03:49 EST 2018 | dleeper
I can't open your spread sheet to see how you calculate this, but usually this sort of calculation assumes the leads are spaced symmetrically on both sides of the part and the center of mass is between them. Gravity pulls the part down, while the wet
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Thu Feb 14 08:14:12 EST 2008 | davef
Questions are: * Do the BGA pads on the board take solder when you solder them by hand? * What is the temperature on the BGA pads during reflow? * What is the temperature on the other component pads during reflow?
Electronics Forum | Tue Dec 11 09:46:58 EST 2018 | davef
What is the difference of the components that fall and the ones that don't fall?
Electronics Forum | Tue Dec 04 02:32:38 EST 2018 | ameenullakhan
Hi, Thanks for the valuable feedback. Agree with you. 1. We have similar component on both the side of the board. 2. The component fall was random like 4 out of 100 components.But last build it has increased. 3. Applying glue dot is option , bu
Electronics Forum | Mon Dec 03 03:58:24 EST 2018 | ameenullakhan
Hi , Observed component drop during second reflow. Component : Image attached Perimeter : 0.15 to 0.025 cm No of leads : 22 Solder Alloy : Sn63/Pb37 As per component adhesion calculation the component should not fall. ( Excel Attached ) Profile
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