Electronics Forum | Thu Nov 02 22:19:32 EST 2000 | Dason C
For 0402 or less, it is prefer to start on the pad design but it doesn't help right now. Senju Metal say that they have develop one of the paste can reduce the tombstoning problem but I don't have chance to test it. Please try and post your finding
Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22
Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.
Electronics Forum | Mon Apr 02 09:24:16 EDT 2007 | ed_faranda
I do this ALL the time, and it is pretty much transparent to the process. We have done shake, burn in, and functional tests with our products and we didn't have any issues what so ever. We have had a RoHS complient process for well over 18 months n
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Wed May 13 10:34:57 EDT 2015 | squeekypigeon
If memory serves me right, if you are test picking a component which will be served to the machine via an LCS the 'pick position' will automatically set itself to feeder slot 1. If you change this to something more central (I used to use location 4
Electronics Forum | Wed May 13 12:39:25 EDT 2015 | arbpkevin
Ahh, yes. Just about the same time you replied someone else I asked said the same thing! I didn't realize that you had to put the part on by hand for the vision test. In the book it says to leave the feeder position set to the default setting. Fu
Electronics Forum | Wed Aug 07 13:46:18 EDT 2019 | tey422
I have a question regarding is there any trick/tip able to quickly identify if a component is not clean/washable? Or a list of mfg p/n which already know are not clean/wash? We have an assembly would need to change the process from No-Clean to Clean
Electronics Forum | Wed May 06 20:52:26 EDT 2015 | arbpkevin
I have been using my topaz X for about 4 years now and I feel that I am fairly knowledgeable about it, at least the functions of it that I use... I am trying to use the LCS to place some qfp chips on a new product and I have set the whole thing up t
Electronics Forum | Thu Nov 05 03:40:34 EST 2009 | valeo
Hi Rajeshmara, Mail sent with the datasheet of the glue we use in production. Thanks for first information you provide me for the shear specifications on 1206. But can you be more precise on this point ? How did you define it ? Is anyone have more
