Electronics Forum: component shell life (Page 4 of 40)

Heat guns and component damage

Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks

OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a

Humidity of SMT component storage environment.

Electronics Forum | Mon Jan 22 20:14:52 EST 2001 | davef

Take note that contrary to popular belief, it is not acceptable to assume that the floor life clock will be temporarily stopped when components are put back in dry storage following exposure to ambient conditions exceeding one hour. ... why doesn�t

Humidity of SMT component storage environment.

Electronics Forum | Sat Jan 20 20:54:03 EST 2001 | fmonette

Dear Mike, As you might have noticed from the labels on the dry bags, the maximum floor life is specified by the component manufacturer and it can range from 1 year (level 2) down to a few hours after mandatory bake (level 6). This limit is based o

Humidity of SMT component storage environment.

Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette

This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha

No-Lead solder defect - No solder on pads

Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel

Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o

Re: Flux evaporation....???

Electronics Forum | Thu Oct 21 11:32:15 EDT 1999 | John Thorup

Larry Elaborating on the specific question, yes, the volatile solvents in the flux can and will evaporate. Evaporate completely in any reasonable amount of time? Probably not. What tends to happen is that the exposed paste dries on the surface and

No-Lead solder defect - No solder on pads

Electronics Forum | Mon Dec 22 15:35:18 EST 2003 | davef

Marc: Please be more explicit. * When you say, "parts have a metal shell"; are you talking about the component leads or the component body? What is the metal, what is it appearance, and what are it's implications? * When you say, "the parts have a

Application of vacuum technology

Electronics Forum | Tue Aug 17 09:43:59 EDT 2021 | lay1014

Application of vacuum technology VACUUM FURNACE Metallurgical industry: The vacuum technology used in the metallurgical industry includes molten steel vacuum processing, vacuum melting, vacuum induction melting, induction shell melting, vacuum arc re

Possibility of a cheaper pick and place machine design?

Electronics Forum | Mon Jul 07 21:33:15 EDT 2014 | andrespena

The problem about covering it with glue (without using solder) is that the components might dislodge by a miniscule amount underneath the glue. So maybe the contact points will disconnect. I'm not sure if this will be a real problem, but if so it wo

Shelf Life of Components

Electronics Forum | Wed Dec 01 02:03:41 EST 1999 | Chris May

Does anyone have any data or views on recommended shelf life / Date of Manufacture for components ?? Regards, Chris.


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