Electronics Forum | Fri Sep 25 10:30:07 EDT 2020 | majdi4
2 process to increase the robustness of the bga against all constraints
Electronics Forum | Sat Aug 17 07:34:36 EDT 2002 | bentzen
Hi Ken First of all, I think you are right to point out that the uptime should be calculated on the SMD line bottleneck. But I have some comments to your posting in general: The SMD line bottleneck, you say, is always the palcement machine. This i
Electronics Forum | Mon Oct 09 06:16:31 EDT 2017 | jamesbarnhart
I think you needed an IPC Class 3 annular ring because for very dense designs, the smaller the annular ring the better, as less space is taken by the pad or via and more space can be dedicated to routing the traces in highly populated areas of the bo
Electronics Forum | Mon Jun 18 12:31:21 EDT 2001 | ashokdha
Gil For BGA Inspection, What are the other technologies available to us ( e.g. infrared ? ultrasound ? laser ? Mirrors ? ) Can you provide your perspective on that ? How safe and cost effective the X-Ray system is as compared to other methods of i
Electronics Forum | Fri Nov 12 17:58:18 EST 1999 | Jason Nipper
I have been actively experimenting with Selective WS pallets fabricated from Delmat. I need feedback from users on life expectancy, demesion constraints relative to warpage or degradation, and any useful info on ways to maximize life and prevention
Electronics Forum | Fri Jul 30 18:34:51 EDT 2010 | ranas
hi, just want to seek info regarding LF supplier who can do flip chip LF with solder nuggets. our supplier from USA is going to be closed due to financial constraint.. Anybody who can recommend.. asia location is preferrable.. thanks, Ranas
Electronics Forum | Tue May 28 12:29:29 EDT 2024 | carl_p
Depends on the product & constraints your having to deal with. I've used the following in the past; Stepped Stencil, Overprint, Additional dispensing equipment after the print process & Solder pre forms
Electronics Forum | Mon Sep 25 17:14:40 EDT 2000 | LarryK
Greg, Its an open ended question your asking here. What are you trying to do? Determine if your equipment is able to do what you need? E Determine your floor spacing? Determine what, if any, inspection equipment is needed? Determine constraints/line
Electronics Forum | Fri Aug 17 09:52:21 EDT 2001 | Mike Kennedy
We have looked into it and were very impressed. I havn't seen another peice of equipment that can bring back visual inspection to a BGA solder joint. We havn't yet purchased one because of budget constraints, but I am keen to eventually get one for o
Electronics Forum | Thu Feb 27 09:40:19 EST 2003 | jseagle
Hi, I am looking for opinions on closed-loop inline washers. We use water-soluble paste and flux, most of our boards are double-sided, and our finest pitch is 16mil, but we will be doing BGA, uBGA, and possibly flip chip in the future. What would
