Electronics Forum | Wed Sep 27 08:28:05 EDT 2006 | AR
Hi all All you wave soldering people, have you had any trouble in keeping the copper level of your SAC solder pots under control? How do you combat the gradual rise of copper contents owing to dissolution from through-hole component leads etc.?
Electronics Forum | Wed Sep 27 10:02:24 EDT 2006 | aj
Hi, We are using SACX and have not noticed any rise in copper. I do know that there are Solder Bars available without the Copper to try and bring the level under control. aj...
Electronics Forum | Thu Oct 05 12:52:34 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon! Typically, we normally recommend testing the pot, and adding either Sn/Ag or just Sn to keep it at bay. One nice thing about the solubility of Cu in Sn based alloys is that it should reach a theoretical upper limit of about 0.1%. I
Electronics Forum | Thu Aug 14 18:45:35 EDT 2003 | bman
An idea I just heard today would be to run a strip of copper tape across each shelf, then screw the tape into the shelf to ensure metal to metal contact. Considering the shelves seem to all have a path to ground through the supports, I don't see why
Electronics Forum | Sun Feb 05 08:41:15 EST 2006 | Cmiller
Are you refering to reflow soldering or wave soldering? Brian, do you have any data to support that SAC305 is more reliable than Tin-Copper-Nickel? NEMI reccomended SAC type alloys for reflow and Tin-Copper for wave. See: http://circuitsassembly.
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Wed May 08 23:48:01 EDT 2002 | ianchan
Hi mates, someone told us to use mild HCL acid 5% to 10% solution and submerge the LCC parts into this solution. hopefully this will clean off the varient copper oxide layer on the LCC leadless terminal wall. after the HCL soak, submerge the parts
Electronics Forum | Thu May 09 11:59:34 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Thu May 09 12:00:32 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Wed May 14 10:20:37 EDT 2014 | julianf
Hello all! For my mechanical engineering study I want to etch a strain gauge in the Wheatstone bridge configuration in a copper layer of an PCB. The goal is to measure the strain occurring in an PCB even during the press process! We can measure with
