Electronics Forum | Wed Jan 11 15:21:51 EST 2012 | pr
Can anyone recommend fans to put on the conveyors post reflow? Thank you, PR
Electronics Forum | Thu Feb 09 09:45:50 EST 2006 | PWH
I'm not familiar with the HVN70 programming but our conceptronic oven reacts well to adjusting the cooling fan speed at the end of the oven. However, TAL will likely be affected substantially by changing fan speed.
Electronics Forum | Fri Feb 10 09:18:04 EST 2006 | aj
is that fan speed program controlled or manually?
Electronics Forum | Mon May 10 10:08:16 EDT 1999 | Rich Taylor
Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not?
Electronics Forum | Mon May 10 13:55:22 EDT 1999 | Deon Nungaray
| Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | I do not think there is a "typical" post reflow cooling rate out ther
Electronics Forum | Wed May 12 10:29:25 EDT 1999 | Timothy O'Neill
| | | Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | | | I do not think there is a "typical" post reflow cooling rate
Electronics Forum | Mon May 10 15:49:52 EDT 1999 | Steve Gregory
| | Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | | I do not think there is a "typical" post reflow cooling rate out
Electronics Forum | Mon Oct 31 19:37:16 EDT 2022 | emeto
Just because you can't add copper to the board, doesn't mean you can't add copper to the panel. Redesign panel, where board house can add copper to the panel to balance the board a little better. I would advise against low melting solder alloys on cu
Electronics Forum | Fri Feb 13 03:26:07 EST 1998 | Brian S. Bentzen
Hi , The 4th stage in reflow soldering, the cool-down, I find is often over looked. A rapid cooling rate should give finer lead and tin structure with more bindings and thereby result in stronger solder joints. Can anybody give me some information
Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F
Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca
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