Electronics Forum | Fri Jun 09 10:01:39 EDT 2017 | jkitt84
Ed, this is great info. Thanks. Jeff
Electronics Forum | Tue Aug 28 07:36:25 EDT 2007 | davef
If the copper on your PTH is not one thou, you will get blowholes. With the cost of copper going through the ceiling, you will get less than one thou of copper plating from substandard suppliers. Consider baking your boards prior to wave soldering
Electronics Forum | Sat Oct 28 10:24:56 EDT 2000 | Ben
Try to insert thin copper plate (approx. 1.5mm thk) at the end of the flow direction. Place it approx. 2mm away from the lead. The copper will pull away the solder & thus minimise bridging problem.
Electronics Forum | Tue May 31 10:58:31 EDT 2005 | davef
There are a host of possibilities. Virtually any fabrication process prior to outer layer manufacturing prior to HAL could contribute to dewetting. That goes all the way to excessive brighteners in the copper plating line. Anything that prevents the
Electronics Forum | Wed Sep 27 19:37:32 EDT 2000 | Dave F
Wolfgang is correct. Copper plating thickness of the via barrel walls is a key question you need to answer to troubleshoot this. Tenting is a red herring.
Electronics Forum | Sat Jul 25 08:47:25 EDT 2009 | davef
Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper
Electronics Forum | Tue Sep 30 21:00:41 EDT 2003 | davef
We're not clear on what you seek. So, as a starting point for our discussion, we wouldn't get agitated if we saw "routine" coplanarity of 4 thou. For instance: Maximum Lead Coplanarity [Altera] Package||Acronym||Lead material||Finish||Maximum Lead
Electronics Forum | Wed Jun 21 08:31:36 EDT 2006 | don dawson
Depending on the material, the etching can damage the dielectric. This can be manufactured but is difficult and expensive. Copper plating and other processes that require agitation are almost impossible.
Electronics Forum | Fri Jul 24 23:20:11 EDT 2009 | umar
Hi Dave, Thanks on your feedback, May I know the how's the contributing of Moisture content of bare board and the Thickness of the copper plating in the PTH to the solder ball and solder splash during hand soldering process ?
Electronics Forum | Thu Oct 17 05:16:44 EDT 2013 | vincentdesilva2003
Anyone can help me how many percentage of blowholes and pinholes if i do the followings: 1. Increase copper plating thickness more than 25 microns. 2. Pre Baking of PCB to remove gassing by drying out the PCB's
winsouce.jpg)
.gif)
